Ultra clean processing of semiconductor surfaces XII selected, peer reviewed papers from the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) September 21-24, 2014, Brussels, Belgium

Collection of selected, peer reviewed papers from the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 21-24, 2014, Brussels, Belgium. The 71 papers are grouped as follows: Chapter 1: Cleaning for FEOL Applications,Chapter 2: Cleaning for FEOL Appli...

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Detalles Bibliográficos
Autor Corporativo: International Symposium on Ultra Clean Processing of Semiconductor Surfaces (-)
Otros Autores: Mertens, Paul (-), Meuris, Marc, Heyns, Marc
Formato: Libro electrónico
Idioma:Inglés
Publicado: Pfaffikon, Switzerland : TTP 2014.
Colección:EBSCO Academic eBook Collection Complete.
Solid state phenomena ; v. 219.
Acceso en línea:Conectar con la versión electrónica
Ver en Universidad de Navarra:https://innopac.unav.es/record=b32572748*spi
Descripción
Sumario:Collection of selected, peer reviewed papers from the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 21-24, 2014, Brussels, Belgium. The 71 papers are grouped as follows: Chapter 1: Cleaning for FEOL Applications,Chapter 2: Cleaning for FEOL Applications: Beyond-Si Active Area, Chapter 3: Wet Etching for FEOL Applications,Chapter 4: Wet Processing of High Aspect Ratio Structures, Chapter 5: Fluid Dynamics, Cleaning Mechanics,Chapter 6: Photo Resist Performance and Rework, Chapter 7: Cleaning for BEOL Interconnect Applications, Chapter 8: Cleaning for 3D Applications, Chapter 9: Contamination Control and AMC,Chapter 10: Cleaning and Wet Etching for Semiconductor Photo-Voltaic Cells Keyword: Ultra-cleaning, precision cleaning, wet cleaning, Semiconductor Surfaces, contamination control, surface impurities, surface defects, Integrated circuits, Micro-electronic structures, photovoltaic processing, proceedings UCPSS.
Descripción Física:331 p. : il
Formato:Forma de acceso: World Wide Web.
Bibliografía:Incluye referencias bibliográficas e índice.
ISBN:9783038266266