Handbook of VLSI microlithography principles, technology, and applications
This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the specia...
| Otros Autores: | |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Park Ridge, N.J. : Norwich, N.Y. :
Noyes Publications ; William Andrew Pub
2001.
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| Edición: | 2nd ed |
| Colección: | Materials science and process technology series. Electronic materials and process technology.
Science Direct e-books. |
| Acceso en línea: | Conectar con la versión electrónica |
| Ver en Universidad de Navarra: | https://innopac.unav.es/record=b25440767*spi |
| Sumario: | This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge, and pattern feature dimension control. The book's explanation of resist and resist process equipment technology describes the relationship between the resist process and equipment parameters. The basics of resist technology are also covered - including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. |
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| Descripción Física: | 1 recurso electrónico (xxi, 1001 p.) : il |
| Formato: | Forma de acceso: World Wide Web. |
| Bibliografía: | Incluye referencias bibliográficas e índice. |
| ISBN: | 9781591242758 9780815514442 9780815517795 |
