| Sumario: | On behalf of the organizing committee, we are delighted to welcome you to the 2020 ACM International Symposium on Physical Design (ISPD), held in Taipei, Taiwan. We continue the great tradition established by its twenty-eight predecessors, which includes a series of five ACM/SIGDA Physical Design Workshops held intermittently in 1987-1996 and twenty-three editions of ISPD in the current form since 1997. The 2020 ISPD provides a premier forum to present leading-edge research results, exchange ideas, and promote research on critical areas related to the physical design of VLSI and other related systems. The regular papers in the ISPD 2020 program were selected after a rigorous, month-long, double-blind review process and a face-to-face meeting by the Technical Program Committee (TPC) members. The papers selected exhibit latest advancements in a variety of topics in physical design, including emerging challenges for current and future process technologies, FPGA architectures, placement, detailed routing, floorplanning and interconnect planning, partitioning techniques, manufacturability and yield optimization, timing and crosstalk issues, analysis and management of power dissipation, hardware security, placement and routing approaches of networks on chips, gate sizing and clock skew scheduling, and application of machine-learning based techniques to physical design. The ISPD 2020 program is complemented by three keynote addresses, six invited talks, the results of the ISPD wafer-scale deep learning accelerator placement contest, the ISPD lifetime award commemorative session, sessions on placement, security, timing, clocking, new trends in physical design, and two sessions on machine learning in physical design, all of which are presented by distinguished researchers from both industry and academia. Dr. Ivo Bolsens, Senior Vice President and Chief Technology Officer at Xilinx, will deliver the Monday morning keynote address entitled "Scalable System and Silicon Architectures to Handle the Workloads of the Post-Moore Era." Dr. Bolsens keynote will explore how digital systems need to scale in order to meet the needs of the computations of tomorrow. Dr. Cliff Hou, Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), will deliver the Tuesday morning keynote address entitled "Physical Design for 3D Chiplets and System Integration." In his keynote, Dr. Hou will discuss three-dimensional integration of chips and the challenges imposed on physical design in order to facilitate reliable and economical manufacturing of these systems. Juan C. Rey, Vice President of Engineering, Calibre division of Mentor - A Siemens Business, will present the Wednesday morning keynote speech entitled "Physical Verification at Advanced Technology Nodes and the Road Ahead." This keynote will focus on the major challenges facing the verification of the extremely dense and complex manufacturing design rules of the current and future technology nodes. Professor Marilyn Wolf will moderate the ISPD Lifetime Achievement Award session in honor of Dr. Louis K. Scheffer. This session highlights Lou's contributions to Electronic Design Automation and will share insights found which working at Valid Logic, Cadence, and his current work in neurobiology at the Janelia Research Campus.
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