TEI '14 : proceedings of the eighth International Conference on Tangible, Embedded and Embodied Interaction : Munich, Germany, February 16-19, 2014

Detalles Bibliográficos
Autor principal:	Butz, Andreas (-)
Autores Corporativos:	International Conference on Tangible, Embedded and Embodied Interaction Corporate Author (corporate author), International Conference on Tangible, Embedded and Embodied Interaction (-), SIGCHI (Group : U.S.) Content Provider (content provider)
Formato:	Libro electrónico
Idioma:	Inglés
Publicado:	[Place of publication not identified] ACM 2013
Colección:	ACM Conferences
Materias:	Engineering & Applied Sciences Computer Science
Ver en Biblioteca Universitat Ramon Llull:	https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009712899706719

Descripción
Notas:	Bibliographic Level Mode of Issuance: Monograph
Descripción Física:	1 online resource (401 pages)

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