Characterization of integrated circuit packaging materials
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...
| Otros Autores: | , , , , , |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Stoneham, Massachusetts ; Greenwich, Connecticut :
Butterworth-Heinemann
1993.
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| Colección: | Materials characterization series.
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| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009629661306719 |
| Sumario: | Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.<br> |
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| Notas: | Description based upon print version of record. |
| Descripción Física: | 1 online resource (293 p.) |
| Bibliografía: | Includes bibliographical references at the end of each chapters and index. |
| ISBN: | 9781483292342 |
