Developments in surface contamination and cleaning Volume 7 : cleanliness validation and verification Volume 7 :
As device sizes in the semiconductor industries are shrinking, they become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not as effective at smaller scales. The book series Developments in Surface Contamination and Cleaning...
| Otros Autores: | , , , |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Kidlington, England ; Waltham, Massachusetts :
William Andrew
2015.
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| Edición: | First edition |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009629474106719 |
Tabla de Contenidos:
- Front Cover; Developments in Surface Contamination and Cleaning: Cleanliness Validation and Verification; Copyright; Contents; Contributors; Preface; About the Editors; Chapter 1: Sources and Generation of Surface Contaminants and Their Impact; 1. Introduction; 2. Surface Cleanliness Levels; 3. Sources and Generation of Contaminants; 3.1. Particles; 3.2. Thin Film or Molecular Contamination; 3.3. Ionic Contamination; 3.4. Microbial Contamination; 4. Impact of Contaminants; 4.1. Particle Contamination; 4.1.1. Health Effects; 4.2. Molecular Contamination; 4.3. Ionic Contamination
- 4.4. Microbial Contamination5. Summary and Conclusions; Acknowledgments; Disclaimer; References; Chapter 2: Mid-IR Spectroscopy as a Tool for Cleanliness Validation; 1. Background; 2. Principles of Grazing-Angle FTIR; 3. Description of the Method; 4. Advantages and Disadvantages; 4.1. Direct, Real-Time Method; 4.2. Detect Anything With An IR Spectrum; 4.3. Automation; 4.4. Access to Small Spaces/Flat Surfaces; 5. Results and Applications; 5.1. Aerospace; 5.2. Manufacturing; 5.3. Pharmaceutical Applications; 5.4. Explosives and Chemical Warfare Agents; 5.5. Tank Trials
- 5.6. IRRAS by Direct Reflectance6. Future Developments; 7. Summary; References; Chapter 3: Optically Stimulated Electron Emission: A Powerful Tool for Surface Cleanliness Monitoring; 1. Introduction; 2. OSEE Principle; 2.1. Resolution; 2.2. Repeatability and Reproducibility; 2.3. Calibration; 2.4. Factors Affecting OSEE; 2.4.1. Short-Term Factors; 2.4.1.1. Length of Time the Sample Surface is Exposed to UV Light; 2.4.1.2. Distance of the OSEE Sensor from the Surface; 2.4.1.3. Line Voltage; 2.4.1.4. Ambient Temperature; 2.4.1.5. Atmospheric Pressure; 2.4.1.6. Sample Not Properly Grounded
- 2.4.1.7. Surface Finish2.4.1.8. Air Flow/Turbulence Past the OSEE Sensor; 2.4.1.9. Humidity; 2.4.1.10. Static Charge; 2.4.2. Long-Term Factors; 2.4.2.1. UV Light Intensity; 2.4.2.2. Collector Bias Voltage; 3. Photoemitting Materials; 3.1. Substrate Emitting and Contaminant Nonemitting; 3.2. Substrate Nonemitting and Contaminant Emitting; 3.3. Both Substrate and Contaminant Emitting; 3.4. Both Substrate and Contaminant Nonemitting; 4. Applications of OSEE; 4.1. Surface Cleanliness Monitoring; 4.1.1. Establishing Surface Cleanliness Level
- 4.1.1.1. Selecting an Appropriate Cleanliness Monitoring Technique4.1.1.2. Establishing Acceptable Level of Cleanliness; 4.1.1.2.1. Empirical Approach; 4.1.1.2.2. Quantitative Approach; 4.1.2. Example Applications of Surface Cleanliness Monitoring; 4.1.2.1. Prebond Surface Quality; 4.1.2.1.1. Application 1; 4.1.2.1.2. Application 2; 4.1.2.1.3. Application 3; 4.1.2.2. Surface Finish; 4.1.2.3. Selecting the ""Right"" Cleaning Process; 4.1.2.4. Optimizing a Cleaning Process; 4.1.2.5. Contamination Detection on Weld Surfaces; 4.1.2.6. Copper Foil Characterization and Cleanliness Testing
- 4.1.2.7. Inspection for Flux Residue on Electronics Assemblies
