Electromigration in thin films and electronic devices materials and reliability
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one...
| Otros Autores: | |
|---|---|
| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Oxford ; Philadelphia :
Woodhead Pub
c2011.
|
| Edición: | 1st edition |
| Colección: | Woodhead Publishing Series in Electronic and Optical Materials
|
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009628369806719 |
| Sumario: | Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin |
|---|---|
| Notas: | Description based upon print version of record. |
| Descripción Física: | 1 online resource (353 p.) |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 9780857093752 |
