Three-dimensional integrated circuit design

With vastly increased complexity and functionality in the ""nanometer era"" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elem...

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Detalles Bibliográficos
Autor principal: Pavlidis, Vasilis F. (-)
Otros Autores: Friedman, Eby G.
Formato: Libro electrónico
Idioma:Inglés
Publicado: Amsterdam ; Boston : Morgan Kaufmann c2009.
Edición:1st edition
Colección:Morgan Kaufmann series in systems on silicon.
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627720306719
Descripción
Sumario:With vastly increased complexity and functionality in the ""nanometer era"" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing e
Notas:Description based upon print version of record.
Descripción Física:1 online resource (324 p.)
Bibliografía:Includes bibliographical references and index.
ISBN:9781282711396
9786612711398
9780080921860