Grounds for grounding : a handbook from circuits to systems

Grounds for grounding a handbook from circuits to systems

GROUNDS FOR GROUNDING Gain a comprehensive understanding of all aspects of grounding theory and application in this new, expanded edition Grounding design and installation are crucial to ensure the safety and performance of any electrical or electronic system irrespective of size. Successful groundi...

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Detalles Bibliográficos
Otros Autores: Joffe, Elya B., autor (autor), Lock, Kai-Sang, autor
Formato: Libro electrónico
Idioma:Inglés
Publicado: Piscataway, NJ : Hoboken, New Jersey : IEEE Press [2023]
Edición:Second edition
Colección:Wiley ebooks.
Acceso en línea:Conectar con la versión electrónica
Ver en Universidad de Navarra:https://innopac.unav.es/record=b47387993*spi
Tabla de Contenidos:
  • Author Biographies xxi
  • Foreword xxiii
  • Preface to the Second Edition xxv
  • Acknowledgments xxvii
  • 1 Overview 1
  • References 7
  • 2 Fundamental Concepts 9
  • 2.1 Maxwell's Equations Demystified 9
  • 2.1.1 Fundamental Terms 11
  • 2.1.2 Maxwell's Equations 13
  • 2.2 Boundary Conditions 27
  • 2.3 Intrinsic Inductance of Conductors and Interconnects 28
  • 2.3.1 Concept of Inductance 28
  • 2.3.2 Self-Inductance 29
  • 2.3.3 Mutual Inductance 31
  • 2.3.4 Partial Inductance 32
  • 2.3.5 External and Internal Inductance 36
  • 2.3.6 Conductors as Materials 37
  • 2.3.7 Skin Effect and Skin Depth 38
  • 2.3.8 Proximity Effect 43
  • 2.4 Nonideal Properties of Passive Circuit Components and Interconnects 47
  • 2.4.1 "Real-World" Resistors 49
  • 2.4.2 "Real-World" Capacitors 50
  • 2.4.3 Antiresonance of Parallel (Nonideal) Capacitors 52
  • 2.4.4 "Real-World" Inductors 55
  • 2.4.5 Interconnects (Wires and PCB Traces) 56
  • 2.5 Return Current Path Impedance 57
  • 2.5.1 How Current Flows 58
  • 2.5.2 What Path Should Return Currents Follow? 58
  • 2.5.3 Is the Shortest Path Always the Best? 60
  • 2.5.4 What If Alternate Paths Are Available? 60
  • 2.5.5 Equivalent Circuit Analysis 62
  • 2.5.6 Implication of the Principle 71
  • 2.6 Spectral Content of Signals 73
  • 2.6.1 Radiation Efficiency and Electrical Length 74
  • 2.6.2 Periodic Pulsed Signals 74
  • 2.6.3 Random (Aperiodic) Pulsed Signals 77
  • 2.6.4 Effect of Ringing on the Spectrum of Pulsed Signals 78
  • 2.6.5 Spectrum Conservation 81
  • 2.7 Transmission Line Fundamentals 84
  • 2.7.1 Transmission Line Definition 84
  • 2.7.2 Transmission Line Equations and Intrinsic Parameters 84
  • 2.7.3 The Dual View of Signals and Interconnects 86
  • 2.7.4 Transmission Line Termination and Loading Conditions 87
  • 2.8 Modes of Signal Propagation 91
  • 2.8.1 Differential-Mode and Common-Mode Signals 91
  • 2.8.2 Common-Mode Interference-Generation Mechanism and Its Mitigation 93
  • 2.8.3 Differential Signaling and Balanced Circuits 98
  • 2.8.4 Common-Mode (CM) to Differential-Mode (DM) Conversion 106
  • 2.8.5 Even- and Odd-Mode Impedances 109
  • 2.9 Interaction Between Sources to Radiated Fields 118
  • 2.9.1 Radiation from Current-Carrying Conductors 118
  • 2.9.2 Flux Cancellation, the Electromagnetics of Balancing 122
  • 2.9.3 Not all Common-Mode Currents are Bad ... 125
  • 2.10 Out of Band Susceptibility in Solid-state Devices 126
  • 2.10.1 RFI Rectification Mechanism in p-n Junctions 126
  • 2.10.2 Digital and Linear IC Interference Susceptibility 129
  • 2.10.3 Susceptibility of Op-Amps to Ground-Coupled EMI 132
  • References 135
  • 3 The Grounds for Grounding 137
  • 3.1 Grounding, an Introduction 137
  • 3.1.1 "Grounding," One Term, Many Imports 137
  • 3.1.2 The Grounding Symbol - Adding to the Confusion 141
  • 3.1.3 Grounding-A Historical Perspective and the Evolution of the Term 144
  • 3.1.4 Grounding-Related Myths, Misconceptions, and Misapprehensions vs. Facts and Sensible Choices 147
  • Interconnected Equipment 149
  • 3.2 Objectives of Grounding 152
  • 3.2.1 Electrical Safety Grounding 153
  • 3.2.2 Grounding for Control of Electromagnetic Interference (EMI) 163
  • 3.2.3 Signal Grounding 166
  • 3.2.4 Summary of Grounding Objectives 169
  • References 170
  • 4 Fundamentals of Grounding Design 171
  • 4.1 Ground-Coupled Interference and Its Preclusion 171
  • 4.1.1 Grounding May Not Be the Solution; Rather, it is Part of the Problem 171
  • 4.1.2 The Good Earth 174
  • 4.1.3 Controlling Common-Impedance Interference Coupling 176
  • 4.2 Fundamental Grounding Schemes 186
  • 4.2.1 The Need for Different Schemes 186
  • 4.2.2 Fundamental Grounding Schemes 189
  • 4.2.3 Grounding Schemes in Complex Systems 208
  • 4.3 Grounding Trees 213
  • 4.3.1 Objectives and Basic Design Considerations 213
  • 4.3.2 Ground Tree Design Methodology 214
  • 4.4 Role of Isolated Switch-Mode Power Supplies in Grounding System Design 223
  • 4.4.1 Principle of Switch-Mode Power Supply Operation 224
  • 4.4.2 The Need for Isolation in Switch-Mode Power Supplies 227
  • 4.4.3 Isolation and Grounding in Switch-Mode Power Supplies 230
  • 4.4.4 Isolation Requirements and Testing 232
  • 4.5 Ground Loops 234
  • 4.5.1 Definition of a "Ground Loop" 235
  • 4.5.2 "Who's Afraid of the Big Bad Loop?," or - Ground Loop Consequences 239
  • 4.5.3 Ground Loop Interference Coupling Mechanisms 240
  • 4.5.4 Ground Loop Interactions: Frequency Considerations in CM to DM Interference Conversion 250
  • 4.5.5 Resolving Ground Loop Problems 255
  • 4.6 Zoned Grounding 274
  • 4.6.1 Electromagnetic Topology 274
  • 4.6.2 The Zoning Concept as Applied to Grounding 276
  • 4.6.3 Zoning Compromises and Violation 277
  • 4.6.4 Impact of Zoning on Subsystem Grounding Architecture 278
  • 4.7 Equipment Enclosure and Signal Grounding 279
  • 4.7.1 External Signal and Safety Grounding Interconnects Between Enclosures 279
  • 4.7.2 Equipment DC Power, Signal, and Safety Grounding 280
  • 4.7.3 Power Distribution Grounding Schemes in Integrated Clustered Systems 281
  • 4.7.4 Grounding of Equipment Enclosure Shield 285
  • 4.8 Rack and Cabinet Subsystem Grounding Architecture 287
  • 4.8.1 Grounding Ground-Rules in Racks and Cabinets 287
  • 4.8.2 Ground Loops and Their Mitigation in Racks and Cabinets 289
  • 4.8.3 External Grounding of Racks and Cabinets 290
  • 4.9 Grounding Strategy Applied by System Size and Layout 292
  • 4.9.1 One Size Fits None 292
  • 4.9.2 Isolated System 292
  • 4.9.3 Clustered System 292
  • 4.9.4 Distributed System 294
  • 4.9.5 Nested-Distributed System 295
  • 4.9.6 Central System with Extensions 295
  • 4.9.7 Grounding Strategy by System Size and Layout - Summary and Case Study 295
  • References 298
  • 5 Bonding Principles 301
  • 5.1 Objectives of Bonding 301
  • 5.2 Bond Impedance Requirements 303
  • 5.3 Types of Bonds 305
  • 5.3.1 Direct Bonds 305
  • 5.3.2 Indirect Bonds 308
  • 5.3.3 Contact Impedance of Bonds 309
  • 5.3.4 Bonding Impedance Equivalent Circuit 310
  • 5.3.5 Bond Effectiveness 319
  • 5.3.6 Enhancing Bonding Effectiveness 322
  • 5.4 Surface Treatment 323
  • 5.4.1 Roughness of Mating Surface Conditions 323
  • 5.4.2 Surface Contaminants 323
  • 5.4.3 Surface Hardness 324
  • 5.4.4 Contact Pressure 324
  • 5.4.5 Bond Area 324
  • 5.5 Dissimilar Metals and Galvanic Corrosion Control 324
  • 5.5.1 Thermodynamic Basis of Galvanic Corrosion 328
  • 5.5.2 Electrochemical Series 333
  • 5.5.3 Galvanic Series 335
  • 5.5.4 Electrochemical Kinetics of Galvanic Corrosion - Blame it on Faraday 335
  • 5.5.5 Galvanic Couples 340
  • 5.5.6 Impact of Environment on Galvanic Corrosion 342
  • 5.5.7 Effects of Corrosion on EMC Performance 346
  • 5.5.8 Corrosion Protection and Control 351
  • 5.6 Bonding Verification 360
  • References 362
  • 6 Grounding in Power Transmission and Distribution Networks 365
  • 6.1 Introduction 365
  • 6.2 Overhead Transmission Lines 366
  • 6.3 Underground Power Cable Transmission and Distribution Networks 368
  • 6.4 Earth Fault and Ground Potential Rise 369
  • 6.5 Tolerable Step and Touch Voltages 371
  • 6.6 Earthing for High-Voltage Substations 372
  • 6.6.1 Bonding Requirements 372
  • 6.6.2 Principal Design Considerations 373
  • 6.7 Earthing for Power Distribution System 374
  • 6.7.1 Faults in Power Distribution Systems 374
  • 6.7.2 Electric Shock Hazards 377
  • 6.7.3 Methods of Earthing in Power Distribution Systems 379
  • 6.7.4 The Ungrounded System 380
  • 6.8 Earthing in Low-Voltage Distribution System 382
  • 6.8.1 TN-System 382
  • 6.8.2 TT System 386
  • 6.8.3 IT System 388
  • 6.8.4 Temporary Overvoltage in Low-Voltage Installations Due to Faults Between High-Voltage Systems and Earth 389
  • 6.8.5 Earthing Systems and EMC 392
  • 6.8.6 Requirements for the Installation of Equipment with High-Protective Earth Conductor Current 392
  • 6.8.7 Application of Residual Current Devices for Shock Protection 393
  • 6.9 Equipotential Bonding to Building Structures and Other Services 394
  • References 396
  • 7 Grounding for Generators, UPSs, VSDs, and Instrumentation 399
  • 7.1 Grounding for Generators 399
  • 7.1.1 Ungrounded Generator 400
  • 7.1.2 Resistance Grounding 400
  • 7.1.3 Grounding of Generators in Parallel Operation 403
  • 7.1.4 Grounding and Earth Fault Protection for Generators in Parallel Operation 404
  • 7.1.5 Nuisance Tripping of Generators in Parallel Operation - A Case Study 408
  • 7.1.6 Transfer Switching of Alternate Power Supplies 410
  • 7.2 Grounding for Uninterruptible Power Supplies 412
  • 7.2.1 Grounding Scheme for Static.
  • Double-Conversion UPS 413
  • 7.2.2 Grounding for Transformerless UPS 415
  • 7.3 Grounding for Variable Frequency Drives 416
  • 7.3.1 Stray Currents in VFDs 417
  • 7.3.2 VFD Cables 417
  • 7.4 Grounding Requirements for Instrumentation 418
  • 7.4.1 Grounding Practices for Instrumentation 418
  • 7.4.2 Grounding for Fieldbus Systems 419
  • 7.4.3 The Least You Need to Know 422
  • References 423
  • 8 Grounding for Lightning Protection Systems 425
  • 8.1 An Overview of the Lightning Phenomenon 425
  • 8.2 Lightning Attachment Point and Zones of Protection 426
  • 8.3 The Lightning Protection System 428
  • 8.3.1 The Air Termination Subsystem 428
  • 8.3.2 The Down Conductors 429
  • 8.3.3 The Earth Termination Network 431
  • 8.4 Application of Natural Earth Electrodes 433
  • 8.5 Reduction of the Transient Impedance of Earth Electrodes 433
  • 8.6 Protection Against Transferred, Touch, and Step Voltages 436
  • 8.7 Influence of LV Earthing Schemes on Lightning Overvoltage 438
  • 8.8 Separate or Integrated Electrical and Lightning Grounds 440
  • 8.9 Pitfalls in Earthing and Bonding 445
  • References 446
  • 9 Integrated Facility and Mobile/ Transportable Vehicle Grounding Systems 449
  • 9.1 Facility Grounding Subsystems 450
  • 9.1.1 Earth Electrode Subsystem (EESS) 450
  • 9.1.2 Fault Protection Subsystem (FPSS) 450
  • ...

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