Nanoparticle engineering for chemical-mechanical planarization fabrication of next-generation nanodevices
Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarizat...
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Boca Raton, FL :
CRC Press/Taylor & Francis Group
©2009.
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| Colección: | Open Research Library ebooks.
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| Acceso en línea: | Conectar con la versión electrónica |
| Ver en Universidad de Navarra: | https://innopac.unav.es/record=b44539253*spi |
Tabla de Contenidos:
- Overview of CMP technology
- Interlayer dielectric CMP
- Shallow trench isolation CMP
- Copper CMP
- Nanotopography
- Novel CMP for next-generation devices.
