3D integration for VLSI systems
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usual...
| Otros Autores: | , , |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Boca Raton, Fla. :
CRC Press
2012.
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| Edición: | 1st ed |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627909506719 |
Tabla de Contenidos:
- ch. 1. 3D integration technology : introduction and overview / Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester
- ch. 2. A systems perspective on 3D integration : what is 3D? And what is 3D good for? / Phil Emma and Eren Kursun
- ch. 3. Wafer bonding techniques / Bioh Kim. [et al.]
- ch. 4. TSV etching / Paul Werbaneth
- ch. 5. TSV filling / Arthur Keigler
- ch. 6. 3D technology platform : temporary bonding and release / Mark Privett
- ch. 7. 3D technology platform : wafer thinning, stress relief, and thin wafer handling / Scott Sullivan
- ch. 8. Advanced die-to-wafer 3D integration platform : self-assembly technology / Takafum Fukushima. [et al.]
- ch. 9. Advanced direct bond technology / Paul Enquist
- ch. 10. Surface modification bonding at low temperature for three-dimensional hetero-integration / Akitsu Shigetou
- ch. 11. Through silicon via implementation in CMOS image sensor product / Xavier Gagnard and Nicolas Hotellier
- ch. 12. A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via hybrid Cu-adhesive bonding / Fei Liu
- ch. 13. Power delivery in 3D IC technology with a stratum having an array of monolithic DC-DC point-of-load (PoL) converter cells / Ron Rutman and Jian Sun
- ch. 14. Thermal-aware 3D IC designs / Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan
- ch. 15. 3D IC design automation considering dynamic power and thermal integrity / Hao Yu and Xiwei Huang
- ch. 16. Outlook / Ya Lan Yang.
