3D integration for VLSI systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usual...

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Detalles Bibliográficos
Otros Autores: Tan, Chuan Seng (-), Chen, Kuan-Neng, Koester, Steven J.
Formato: Libro electrónico
Idioma:Inglés
Publicado: Boca Raton, Fla. : CRC Press 2012.
Edición:1st ed
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627909506719

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